AMD today introduced the very first ever Triple Core CPU and some new Quad Core Phenoms even a 65 watt Phenom, and you won’t have to wait months to see them. Some OEMs starting Monday will have the Tri Core chips, infact the first Tri-Core system ever will be sold on QVC Monday. However the retail chain won’t see any of the chips for a few more weeks.
In a conversation with AMD, AMD was asked if the Tri Core CPUs are a broken model. AMD said that no the chips are not a broken model but instead similar to the Quad Core chips, the only difference is that one of the cores is disabled. The chips are so similar in fact that AMD said if there were Multi Processor motherboards available, their tri core and quad core CPUs could be used in conjunction with each other.
The most impressive processor being released today by AMD is the 9100e, an energy efficient quad core with a Max TDP of 65 watts. The other Phenoms have a Max TDP of 125 Watts and the Tri Cores 95 watts.
The Triple Core chips are expected to have a starting price of $150 USD and the new Quad-Cores will start at $209 USD.
AMD Phenom X4 9850 Black Edition processor:
• Processor Frequency: 2.5GHz
• L1 Cache Sizes: 64K of L1 instruction and 64K of L1 data cache per core (512KB total L1 per processor)
• L2 Cache Sizes: 512KB of L2 data cache per core (2MB total L2 per processor)
• L3 Cache Size: 2MB
• Memory Controller Type: Integrated 128-bit wide memory controller*
• Memory Controller Speed: Up to 2.0GHz with Dual Dynamic Power Management
• Types of Memory Supported: Support for unregistered DIMMs up to PC2 8500 (DDR2-1066MHz)
• HyperTransport 3.0: One 16-bit/16-bit link @ up to 4.0GHz full duplex (2.0GHz x2)
• Total Processor Bandwidth: Up to 33.1 GB/s bandwidth
• Packaging: Socket AM2+ 940-pin organic micro pin grid array (micro-PGA)
• Fab location: AMD’s Fab 36 wafer fabrication facilities in Dresden, Germany
• Process Technology: 65-nanometer DSL SOI (silicon-on-insulator) technology
• Approximate Transistor count: ~ 450 million (65nm)
• Approximate Die Size: 285 mm2 (65nm)
• Max Ambient Case Temp: 61o Celsius
• Nominal Voltage: 1.2-1.3 Volts
• Max TDP: 125 Watts
AMD Phenom X4 9750 processor:
• Processor Frequency: 2.4GHz
• L1 Cache Sizes: 64K of L1 instruction and 64K of L1 data cache per core (512KB total L1 per processor)
• L2 Cache Sizes: 512KB of L2 data cache per core (2MB total L2 per processor)
• L3 Cache Size: 2MB
• Memory Controller Type: Integrated 128-bit wide memory controller*
• Memory Controller Frequency: Up to 1.8GHz with Dual Dynamic Power Management
• Types of Memory Supported: Support for unregistered DIMMs up to PC2 8500 (DDR2-1066MHz)
• HyperTransport 3.0: One 16-bit/16-bit link @ up to 3.6GHz full duplex (1.8GHz x2)
• Total Processor Bandwidth: Up to 31.5 GB/s bandwidth
• Packaging: Socket AM2+ 940-pin organic micro pin grid array (micro-PGA)
• Fab location: AMD’s Fab 36 wafer fabrication facilities in Dresden, Germany
• Process Technology: 65-nanometer DSL SOI (silicon-on-insulator) technology
• Approximate Transistor count: ~ 450 million (65nm)
• Approximate Die Size: 285 mm2 (65nm)
• Max Ambient Case Temp: 61o Celsius
• Nominal Voltage: 1.2-1.3 Volts
• Max TDP: 125 Watts
AMD Phenom X4 9100e Energy Efficient quad-core processor Quick Facts:
• Model / Processor Frequency: Energy Efficient AMD Phenom™ 9100e Quad-Core Processor (1.8GHz)
• L1 Cache Sizes: 64K of L1 instruction and 64K of L1 data cache per core (512KB total L1 per processor)
• L2 Cache Sizes: 512KB of L2 data cache per core (2MB total L2 per processor)
• L3 Cache Size: 2MB
• Memory Controller Type: Integrated 128-bit wide memory controller
o *Note: configurable for dual 64-bit channels for simultaneous read/writes
• Memory Controller Frequency: Up to 1.8GHz with Dual Dynamic Power Management
• Types of Memory: Support for unregistered DIMMs up to PC2 8500 (DDR2-1066)
o *Note: future 45nm processors versions to include support for DDR3 memory
• HyperTransport 3.0: One 16-bit/16-bit link @ up to 3.2GT/s full duplex
• Total Processor Bandwidth: Up to 33.1 GB/s bandwidth
• Packaging: Socket AM2+ 940-pin organic micro pin grid array (micro-PGA)
o *Note: Phenom processors are backward-compatible with Socket AM2 motherboards
• Fab location: AMD’s Fab 36 wafer fabrication facilities in Dresden, Germany
• Process Technology: 65-nanometer DSL SOI (silicon-on-insulator) technology
• Approximate Transistor count: ~ 450 million (65nm)
• Approximate Die Size: 285 mm2 (65nm)
• Nominal Voltage: (9100e): 1.10/1.125/1.15V
• Max TDP: (9100e): 65 Watts
• Max Ambient Case Temp: (9100e): 61o Celsius
AMD Phenom X3 triple-core processors Quick Facts:
• Model / Processor Frequency: AMD Phenom™ 8600 Triple-Core Processor (2.3GHz)
• Model / Processor Frequency: AMD Phenom™ 8400 Triple-Core Processor (2.1GHz)
• L1 Cache Sizes: 64K of L1 instruction and 64K of L1 data cache per core (512KB total L1 per processor)
• L2 Cache Sizes: 512KB of L2 data cache per core (2MB total L2 per processor)
• L3 Cache Size: 2MB
• Memory Controller Type: Integrated 128-bit wide memory controller
o *Note: configurable for dual 64-bit channels for simultaneous read/writes
• Memory Controller Frequency: Up to 1.8GHz with Dual Dynamic Power Management
• Types of Memory: Support for unregistered DIMMs up to PC2 8500 (DDR2-1066)
o *Note: future 45nm processors versions to include support for DDR3 memory
• HyperTransport 3.0: One 16-bit/16-bit link @ up to 3.6GT/s full duplex
• Total Processor Bandwidth: Up to 33.1 GB/s bandwidth
• Packaging: Socket AM2+ 940-pin organic micro pin grid array (micro-PGA)
o *Note: Phenom processors are backward-compatible with Socket AM2 motherboards
• Fab location: AMD’s Fab 36 wafer fabrication facilities in Dresden, Germany
• Process Technology: 65-nanometer DSL SOI (silicon-on-insulator) technology
• Approximate Transistor count: ~ 450 million (65nm)
• Approximate Die Size: 285 mm2 (65nm)
• Nominal Voltage: (8600 and 8400): 1.10/1.15/1.20/1.25V
• Max TDP: (8600 and 8400): 95 Watts
• Max Ambient Case Temp: (8600 and 8400): 70o Celsius